Circuit board buried blind hole board

Categories: Circuit board sampling

MOQ: 100 Pieces

Delivery time: 15 Day

PCB sampling: 8L Plate thickness: 2.0mm Outer copper thickness: 3oz Inner copper thickness: 2oz Minimum aperture: 0.25mm Minimum line width/spacing: 5mil Surface treatment: immersion gold Product Usage: Server Power Board Process difficulty: 3-oz thick copper+3-stage blind buried hole

Product Details

As a carrier for electronic components, the number of layers in the multi-layer board and the precision design of the circuit determine the size and performance of the circuit board. This industrial grade robot adopts an 8-layer board design, with 3 m i l/3 m i l line width and line spacing matching. It also packages 10 sets of ICs and 12 sets of BGA, making it a high-end product for high-precision printed circuit boards.

Main process characteristics of circuit board sampling and buried blind hole board

1. Design of buried blind holes;

2. 3mil line width and spacing;

3. BGA ball design needs to be uniform in size;

4. IC green oil bridge 4mil/4mil.